Global Semiconductor Supply Chain

Genuine Parts · Authorised Channels · Worldwide Delivery

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One-Stop Component Sourcing

Focused on Quality and Lead Time — Solving Material Shortages

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Dingxin International — Smart Chip Solutions

Data Centre · Automotive · Industrial · Medical · Consumer

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Why Choose Us?

Dingxin International upholds the spirit of "surpassing ourselves and pursuing quality" and the philosophy of "integrity first", delivering professional, high-quality service to every customer.

Customer Satisfaction

Product Lines

Domestic Agency Lines

Cities Served

Partner Distributors

End Customers

Quality Customers

Core Product Lines

As global technology iterates rapidly and market demand shifts — from the explosive growth of the Internet of Things to the deep penetration of artificial intelligence — every field demands higher performance, lower power and better compatibility from electronic components. Based on precise market judgement, we select and focus on the following core product brands, which fit today’s hot application scenarios and deliver outstanding performance, stable quality systems and complete technical support to meet the diverse needs of our customers.

Samsung full-range DRAM & NAND Flash

1. Samsung DRAM full product line

1. DDR general-purpose memory

DDR5, DDR4, DDR3

2. LPDDR low-power mobile memory (mobile / automotive / slim devices)

LPDDR5X, LPDDR5

LPDDR4X, LPDDR4

GDDR7, GDDR6X, GDDR6

4. HBM high-bandwidth stacked memory

HBM4, HBM3E, HBM3

2. Samsung NAND Flash (V-NAND 3D) full product line

1. Bare V-NAND dies

2. UFS

3. SSD

Micron DRAM & Flash

1. Four categories of Micron DRAM

1. DDR series

DDR5, DDR4, DDR3

2. LPDDR low-power series

LPDDR5X / DDR5 / LPDDR4X

3. GDDR graphics memory

GDDR7, GDDR6X, GDDR6

4. HBM high-bandwidth stacked memory

HBM3E, HBM4

2. Two categories of Micron Flash: NAND Flash + NOR Flash

1. 3D NAND Flash (high-capacity storage)

Bare NAND dies: SLC/MLC/TLC/QLC original dies

Embedded packages: UFS, eMMC (for mobile / IPC / automotive / industrial)

Memory card chips: SD, microSD card controller and storage chips

SSD controller + storage integrated dies

2. NOR Flash (small-capacity boot firmware storage)

SPI NOR, parallel NOR

SK hynix DRAM & Flash

1. Five categories of DRAM

1. DDR standard general-purpose memory

DDR5, DDR4, DDR3

2. LPDDR low-power mobile memory

LPDDR5X, LPDDR5, LPDDR4X, LPDDR6

3. GDDR graphics memory

GDDR6, GDDR7

4. HBM high-bandwidth stacked memory

HBM3E, HBM4, HBM4E

5. DRAM+NAND multi-die packages (MCP family) — uMCP (LPDDR+UFS), eMCP (LPDDR+eMMC)

2. Two categories of Flash: NAND Flash (mainstream high-capacity) and no NOR product line

1. Original bare NAND dies

TLC/QLC endurance grades

2. Embedded BGA integrated flash

UFS (UD310 / UD220)

eMMC (EG510)

3. SSD solid-state products

1. DDR standard general-purpose memory (PC, server, industrial, automotive)

1. DDR4 family

2. DDR5 family (current mainstream high-end)

2. LPDDR low-power mobile memory (mobile, automotive, IoT, portable AI)

1. LPDDR4X (mature, cost-effective)

2. LPDDR5 (mid-range mobile mainstream)

3. LPDDR5X (high-end flagship)

4. Roadmap: LPDDR6 — already sampling, next-generation ultra-low-power mobile memory, not yet in mass production

3. Multi-die package MCP (DRAM + flash in one package)

4. HBM3 high-bandwidth stacked memory

5. Temperature grade coverage (full DDR/LPDDR range)

1. Commercial: -25℃~85℃, mobile, PC, general IoT

2. Industrial: -40℃~95℃, industrial gateways, machine vision, data acquisition

3. Automotive AEC-Q100: -40℃~105℃/125℃, in-car infotainment, ADAS domain controllers, dash cameras

About the Company

Dingxin International was founded in 2018 and is headquartered in Shenzhen, the world's key trading hub for electronic components. Offices have been established in Hong Kong, Shanghai and Wuhan, and through ordering from agents and overseas procurement the company has built a high-quality supply chain. It has grown into a well-known independent distributor of electronic components in China, focused on the sale and service of semiconductor chips.

With a global outlook the company concentrates on chip sales for data centre, automotive electronics, industrial, medical and consumer markets, providing efficient and reliable chip supply and helping customers solve the production problems caused by material shortages and chip discontinuations.

Over many years of development we keep improving service quality, optimising supply resources, implementing standardised quality control, and following a global development path, deepening our roots in the semiconductor industry and making progress together with our customers.

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