Company profile: Founded in 1999 when Infineon was spun out of Siemens' semiconductor division, and headquartered in Munich, Germany. After years of development it has become a major force in the global semiconductor industry. Technology strength: roughly 15% of annual revenue is reinvested in R&D, with a large patent portfolio and industry-leading positions in power semiconductors and sensors, in collaboration with universities and research institutes on new materials and processes. Global footprint: multiple R&D centres and production sites worldwide, covering Europe, the Americas and Asia, with customers among the world's leading automotive manufacturers, industrial equipment suppliers and consumer brands.

Application areas

  • Automotive: IGBTs and MOSFETs are central to efficient EV and hybrid operation, powering motor control and battery management. Safety sensors and microcontrollers are widely used in driver assistance systems such as lane departure warning and automatic emergency braking, while body and comfort systems improve the driving experience through lighting, climate control and window control.
  • Industrial: core support for automated production lines including motor control and sensor data processing. In energy management, power semiconductors improve the conversion efficiency of solar inverters, reducing industrial energy consumption.
  • Communications: used in cellular infrastructure and edge computing to ensure efficient data transfer and stable processing, with RF and wireless chips supporting high-speed data and stable network connections.
  • Consumer electronics: power management chips deliver efficient energy management in smartphones, tablets and laptops, extending battery life.
  • Security: access management, eSIM applications and government ID solutions using advanced cryptographic algorithms and secure protocols, widely used in financial payment, identity authentication and data protection.

Product categories

  • Power devices: Power MOSFETs, IGBTs, intelligent power switches, LDOs, DC-DC converters, lighting ICs, Si/SiC diodes and thyristors, gate driver ICs, motor control ICs and drivers, AC-DC converters, solid-state relays, class-D audio amplifier solutions and intelligent power modules (IPM).
  • Battery management ICs: TLE9009DQU, TLE9012DQU, TLE9015DQU, TLE9018DQK and others.
  • Memory: NOR flash, F-RAM, RRAM, nvsRAM, PSRAM, SRAM, wafer and die memory solutions and embedded flash IP.
  • Microcontrollers: AURIX TriCore 32-bit MCUs, 32-bit PSOC Arm Cortex MCUs, 32-bit TRAVEO T2G Arm Cortex MCUs, Arm Cortex-M based 32-bit industrial MCUs, sensing controllers and MOTIX embedded power ICs.
  • RF and wireless control: antenna components, RF switches, LNA ICs, RF transistors, RF diodes, driver amplifiers, bias and control ICs, CIPURSE products, OPTIGA embedded security and SECORA security solutions.
  • Sensors: magnetic sensors, MEMS silicon microphones, pressure sensors, radar sensors, 3D image sensors (REAL3) and gas sensors.
  • Transceivers: automotive transceivers, powerline communications transceivers and USB controllers including USB-C Power Delivery controllers, USB peripherals, USB hub controllers and USB-C charging port controllers.